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Warsaw Pack Trade Fair

The 11th edition of the Warsaw Pack packaging trade fair took place from April 14–16, 2026. The event sets the direction for the packaging industry’s development. It serves as a forum for discussion and the exchange of experiences, bringing together innovation, business, and end-users. Exhibitors from various fields related to the production and use of packaging were in attendance. Packaging manufacturers, as well as companies specializing in production automation, labeling, and printing, were well-represented.

As in previous years, the trade fair attracted a great deal of interest. Over 600 exhibitors from 17 countries took part. Among others, SPP member companies had booths there: Mondi Warsaw and Stora Enso Wood Products.

The trade fair was accompanied by four conferences held as part of the Warsaw PACKTECH Conference series. These events served as a meeting place for experts in the packaging industry. Attendees had the opportunity to learn about topics related to the latest EU legislation and its impact on the Polish packaging market.

The 7th Packaging Industry Congress, organized by the Polish Chamber of Packaging, took place on April 14 and featured three thematic sessions:

1. Regulations and their implementation in the packaging industry – the presentations covered topics such as the PPWR (Packaging and Packaging Waste Regulation), EPR (Extended Producer Responsibility), and DRS (deposit-return system).
2. The second session focused on innovative packaging materials and technological trends, labeling, traceability, and digital solutions for packaging, as well as technological support for the circular economy (CE), ESG (Environmental, Social, and Governance), and reporting.
3. The final thematic block addressed market competitiveness and responsible communication.

At the same time, Natureef hosted a conference titled “Design the Future of Packaging” It also consisted of three thematic sessions: one aimed at packaging manufacturers, one aimed at packaging consumers, and a European session.

The following day featured two events. Rekopol organized a conference titled: “Circular packaging, extended producer responsibility, and the responsibility of individual system participants”. During the conference, participants discussed the current state of collection and recycling in Poland, upcoming changes for businesses, the challenges companies face in transitioning to single-material packaging, and experiences from the first months of the deposit-refund system’s operation in Poland. The importance of public education in the field of ecology was emphasized.

At the same time, a conference titled “Packaging of the Future in Light of the PPWR – Regulations, Materials, Design” was held, organized by the Creative Packaging Group.

The event was attended by K. Godlewska and J. Żubrzak.

_{Photos: J. Żubrzak, SPP; Graphics: Warsaw Pack}